Core Competitiveness

Customer Oriented: Proactively understand the market dynamics and customers' voice, fast execution and timely feedback.

Advanced Packaging Technology: 20 years fiber optical communication industry experiences, laid us a very solid foundation in optical packaging platform such as optical designing and simulation, materials stress analysis, mechanical and electrical designing, FPC designing, IT software development, automatic manufacturing. Products range: Coaxial TO-CAN & OSA;BOX COB(Chip on Board),COC(Chip on Carrier), COF(Chip on Flex), Flip Chip, Bit rate: 2.5G/10G/25G/40G/100G

Higher Cost-Effective Performance:  Automatic manufacturing, 5S lean manufacturing promotion continuously providing customers higher cost-effective products and services.

Mass-Production and On-time Delivery: Sunstar has various optical components, include customized. However, by leveraging our rich experience in NPI introduction and manufacturing management, we satisfy our customers with different kinds of volume requests, from dozens of products monthly to millions of products monthly. Highly efficient and flexible  ERP IT planning system guarantees the OTD.

Quality Assurance: Sunstar equips with well managed(ES, 5S) workshop, 10K & 100K level clean rooms. From raw materials to Outgoing Quality Control(OQC) are all monitored by ERP system, make sure good traceability, and establishes good partnership with key domestic and oversea suppliers, make sure the core materials are obtainable. Sunstar confirms metals used in products sold to Sunstar are 'DRC Conflict-Free'. Sunstar has well managed QSM with certificates include: ISO9001,ISO14001,TUV, FDA,FCC,UL and has very professional quality analysis capability.

Add:4F,Building D1, Mould Industrial Park,

No.199 of Xiqu Ave,West High-tech Zone,

Chengdu,PC:611731, Sichuan, China



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